[TABLE OF CONTENTS]

1 INTRODUCTION OF GLOBAL SPACE ELECTRONICS MARKET
1.1 OVERVIEW OF THE MARKET
1.2 SCOPE OF REPORT
1.3 ASSUMPTIONS

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY
3.1 DATA MINING
3.2 VALIDATION
3.3 PRIMARY INTERVIEWS
3.4 LIST OF DATA SOURCES

4 GLOBAL SPACE ELECTRONICS MARKET OUTLOOK
4.1 OVERVIEW
4.2 MARKET DYNAMICS
4.2.1 DRIVERS
4.2.2 RESTRAINTS
4.2.3 OPPORTUNITIES
4.3 PORTERS FIVE FORCE MODEL
4.4 VALUE CHAIN ANALYSIS

5 GLOBAL SPACE ELECTRONICS MARKET, BY PLATFORM
5.1 OVERVIEW
5.2 SATELLITE
5.3 LAUNCH VEHICLES
5.4 DEEP SPACE PROBES

6 GLOBAL SPACE ELECTRONICS MARKET, BY APPLICATION
6.1 OVERVIEW
6.2 COMMUNICATION
6.3 EARTH OBSERVATION
6.4 NAVIGATION, GLOBAL POSITIONING SYSTEM (GPS), AND SURVEILLANCE
6.5 TECHNOLOGY DEVELOPMENT AND EDUCATION
6.6 OTHERS

7 GLOBAL SPACE ELECTRONICS MARKET, BY TYPE
7.1 OVERVIEW
7.2 RADIATION HARDENED
7.3 RADIATION TOLERANT 

8 GLOBAL SPACE ELECTRONICS MARKET, BY COMPONENT
8.1 OVERVIEW
8.2 MICROPROCESSORS AND CONTROLLERS
8.3 SENSORS
8.4 APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) 
8.5 MEMORY CHIPS
8.6 POWER SOURCE AND CABLES
8.7 DISCRETE SEMICONDUCTORS
8.8 OTHER

9 GLOBAL SPACE ELECTRONICS MARKET, BY GEOGRAPHY
9.1 OVERVIEW

9.2 NORTH AMERICA

9.2.1 NORTH AMERICA MARKET SNAPSHOT
9.2.2 U.S.
9.2.3 CANADA
9.2.4 MEXICO

9.3 EUROPE

9.3.1 EUROPE MARKET SNAPSHOT
9.3.2 WESTERN EUROPE
9.3.2.1 THE UK
9.3.2.2 GERMANY
9.3.2.3 FRANCE
9.3.2.4 ITALY
9.3.2.5 SPAIN
9.3.2.6 REST OF WESTERN EUROPE
9.3.3 EASTERN EUROPE
9.3.3. 1 POLAND
9.3.3.2 RUSSIA
9.3.3.3 REST OF EASTERN EUROPE

9.4 ASIA PACIFIC

9.4.1 ASIA PACIFIC MARKET SNAPSHOT
9.4.2 CHINA
9.4.3 JAPAN
9.4.4 INDIA
9.4.5 AUSTRALIA & NEW ZEALAND
9.4.6 ASEAN
9.4.7 REST OF ASIA PACIFIC

9.5 MIDDLE EAST & AFRICA

9.5.1 MIDDLE EAST & AFRICA MARKET SNAPSHOT
9.5.2 UAE
9.5.3 SAUDI ARABIA
9.5.4 SOUTH AFRICA
9.5.5 REST OF MEA

9.6 SOUTH AMERICA

9.6.1 SOUTH AMERICA MARKET SNAPSHOT
9.6.2 BRAZIL
9.6.3 ARGENTINA
9.6.4 REST OF SOUTH AMERICA

10 GLOBAL SPACE ELECTRONICS MARKET COMPETITIVE LANDSCAPE
10.1 OVERVIEW
10.2 COMPANY MARKET RANKING
10.3 KEY DEVELOPMENT STRATEGIES

11 COMPANY PROFILES

11.1 BAE SYSTEM
11.1.1 OVERVIEW
11.1.2 FINANCIAL PERFORMANCE
11.1.3 PRODUCT OUTLOOK
11.1.4 KEY DEVELOPMENTS

11.2 COBHAM LIMITED
11.2.1 OVERVIEW
11.2.2 FINANCIAL PERFORMANCE
11.2.3 PRODUCT OUTLOOK
11.2.4 KEY DEVELOPMENTS

11.3 HONEYWELL INTERNATIONAL INCORPORATED
11.3.1 OVERVIEW
11.3.2 FINANCIAL PERFORMANCE
11.3.3 PRODUCT OUTLOOK
11.3.4 KEY DEVELOPMENTS

11.4 MICROCHIP TECHNOLOGY INCORPORATED
11.4.1 OVERVIEW
11.4.2 FINANCIAL PERFORMANCE
11.4.3 PRODUCT OUTLOOK
11.4.4 KEY DEVELOPMENTS

11.5 RUAG GROUP
11.5.1 OVERVIEW
11.5.2 FINANCIAL PERFORMANCE
11.5.3 PRODUCT OUTLOOK
11.5.4 KEY DEVELOPMENTS

11.6 STMICROELECTRONICS
11.6.1 OVERVIEW
11.6.2 FINANCIAL PERFORMANCE
11.6.3 PRODUCT OUTLOOK
11.6.4 KEY DEVELOPMENTS

11.7 TELEDYNE TECHNOLOGIES INCORPORATED
11.7.1 OVERVIEW
11.7.2 FINANCIAL PERFORMANCE
11.7.3 PRODUCT OUTLOOK
11.7.4 KEY DEVELOPMENTS

11.8. TEXAS INSTRUMENTS INCORPORATED
11.8.1 OVERVIEW
11.8.2 FINANCIAL PERFORMANCE
11.8.3 PRODUCT OUTLOOK
11.8.4 KEY DEVELOPMENTS

11.9 TT ELECTRONICS
11.9.1 OVERVIEW
11.9.2 FINANCIAL PERFORMANCE
11.9.3 PRODUCT OUTLOOK
11.9.4 KEY DEVELOPMENTS

11.10 XILINX, INCORPORATED
11.10.1 OVERVIEW
11.10.2 FINANCIAL PERFORMANCE
11.10.3 PRODUCT OUTLOOK
11.10.4 KEY DEVELOPMENTS